Reflow furnace and soldering method
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United States of America Patent
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Oct 19, 2021
Grant Date -
N/A
app pub date -
Feb 13, 2019
filing date -
Jun 27, 2018
priority date (Note) -
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Abstract
A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board.
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