Method for producing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11147166
APP PUB NO 20180288882A1
SERIAL NO

16001973

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Abstract

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Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.

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Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATIONTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Hidenori Tokyo, JP 27 427
Masuko, Takashi Tokyo, JP 76 640
Minegishi, Tomonori Tokyo, JP 17 107
Otake, Shunsuke Tokyo, JP 13 31
Shibata, Tomoaki Tokyo, JP 76 656
Yori, Hanako Tokyo, JP 8 66

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