Chip radio frequency package and radio frequency module
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United States of America Patent
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Sep 28, 2021
Grant Date -
N/A
app pub date -
Jun 3, 2020
filing date -
Feb 5, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
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