Interconnect structure
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United States of America Patent
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Sep 28, 2021
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N/A
app pub date -
Jun 1, 2018
filing date -
Jun 1, 2018
priority date (Note) -
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Abstract
A nitridation treatment method is provided. The nitridation treatment method includes executing a nitridation treatment with respect to a hydrophobic surface defining an interconnect trench to convert the hydrophobic surface to a hydrophilic surface. The nitridation treatment method further includes depositing a seed layer including a conductive material and manganese on the hydrophilic surface. The nitridation treatment method also includes thermally driving all the manganese out of the seed layer to form a diffusion barrier including manganese at the hydrophilic surface. In addition, the nitridation treatment method includes filling remaining space in the interconnect trench with the conductive material to form an interconnect.
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