Burst resistant thin wall heat sink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11131506
APP PUB NO 20190154340A1
SERIAL NO

16257584

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Abstract

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An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Coteus, Paul W Yorktown, US 188 6890
Hall, Shawn A Pleasantville, US 32 1327
Schultz, Mark D Ossining, US 99 1054
Takken, Todd E Brewster, US 66 2025
Tian, Shurong Mount Kisco, US 42 898

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