Low-, medium- and/or high-voltage installation with a bonded current path connection with long-term stability by means of nanomaterials, and method for producing said current path connection

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United States of America Patent

PATENT NO 11128061
APP PUB NO 20190312363A1
SERIAL NO

16340195

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Abstract

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A method for establishing a materially bonded current path connection in low-voltage, medium-voltage and/or high-voltage installations having long-term stability includes providing a first part and/or a second part of a current path with a nanomaterial at least in one region. The first part and the second part of the current path are force-lockingly or form-lockingly connected at least in the respective regions. A supply of a reaction energy together with the nanomaterial creates a conductive and bonded connection between the first part and the second part of the current path. A low-voltage installation, a medium-voltage installation and/or a high-voltage installation is also provided.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS AKTIENGESELLSCHAFTWITTELSBACHERPLATZ 2 MUENCHEN 80333

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Last, Philipp Berlin, DE 3 2
Pohle, Dirk Forchheim, DE 5 19
Werner, Christian Falkensee, DE 45 407
Wuestenberg, Kira Berdien Berlin, DE 1 0

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