Circuit board and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11127664
APP PUB NO 20170110393A1
SERIAL NO

15391861

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Abstract

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A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.

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Patent Owner(s)

Patent OwnerAddress
UNIMICRON TECHNOLOGY CORPNO 179 SHANYING RD GUISHAN DIST TAOYUAN CITY 333422

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tain, Ra-Min Taoyuan, TW 95 646
Tsai, Wang-Hsiang Taoyuan, TW 7 61
Tseng, Tzyy-Jang Taoyuan, TW 133 628
Yang, Kai-Ming Taoyuan, TW 52 109

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