Molded integrated circuit packages and methods of forming the same
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United States of America Patent
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Sep 7, 2021
Grant Date -
Jul 9, 2020
app pub date -
Sep 10, 2019
filing date -
Jan 4, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.
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