Electronics chassis with oscillating heat pipe (OHP)
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United States of America Patent
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Sep 7, 2021
Grant Date -
Feb 25, 2021
app pub date -
Aug 22, 2019
filing date -
Aug 22, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.
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