Continuous solder transfer to substrates
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United States of America Patent
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Sep 7, 2021
Grant Date -
Oct 8, 2020
app pub date -
Apr 8, 2019
filing date -
Apr 8, 2019
priority date (Note) -
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Abstract
In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings.
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