Metal compound chemically anchored colloidal particles and methods of production and use thereof
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United States of America Patent
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Aug 31, 2021
Grant Date -
Apr 4, 2019
app pub date -
Nov 13, 2018
filing date -
Mar 23, 2015
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Abstract
Metal compound chemically anchored colloidal particles wherein the metal compound is in molecular form are disclosed. A facile and fast process to chemically anchor metal compounds uniformly onto colloidal particle surfaces via chemical bonding has been developed. Metal compounds are chemically anchored to the surface of colloidal particles via an organic linking agent. Uniformly distributed metal compounds remain in molecular form after the process. The metal compound chemically anchored colloidal particles can be used as solid catalyst in metal chemical-mechanical planarization process.
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