Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method
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United States of America Patent
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Aug 24, 2021
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N/A
app pub date -
Oct 25, 2019
filing date -
Aug 8, 2016
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Abstract
A plating system comprising a plating tank for applying plate processing to a substrate, a sensor configured to measure actual plating film thickness of the substrate, and a controller configured to control plating current supplied to the plating tank and plating time for the plate processing of the substrate within the plating tank. The controller is capable of setting target plating film thickness, plating current, and plating time as a plate processing recipe. At least one of the plating current and the plating time is automatically corrected so that the actual plating film thickness and the target plating film thickness become equal to each other, and the result is reflected in the plate processing for the subsequent substrate.
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