Conductive adhesive

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United States of America Patent

PATENT NO 11098227
SERIAL NO

16484913

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Abstract

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The conductive adhesive includes a thermosetting resin (A) and a conductive filler (B), and has a loss modulus at 200° C. from 5.0×104 Pa to 4.0×105 Pa.

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Patent Owner(s)

Patent OwnerAddress
TATSUTA ELECTRIC WIRE & CABLE CO LTD3-1 IWATA-CHO 2-CHOME HIGASHIOSAKA-SHI OSAKA 5788585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyagi, Yoshihiko Kizugawa, JP 8 13
Isobe, Osamu Kizugawa, JP 13 74
Kamino, Kenji Kizugawa, JP 12 67

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