Fan-out semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11094623
APP PUB NO 20200176370A1
SERIAL NO

16787758

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Abstract

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A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-SI GYEONGGI-DO 16677

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amagai, Masazumi Suwon-si, KR 41 796
Jeong, Tae Sung Suwon-si, KR 42 540
Kim, Ju Ho Suwon-si, KR 84 329
Kim, Sung Han Suwon-si, KR 114 1043

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