Leadframe and leadframe package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11088056
APP PUB NO 20200135628A1
SERIAL NO

16660818

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Importance

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Abstract

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A leadframe includes a substrate and a surface layer covering the substrate. The surface layer includes an acicular oxide containing CuO at a higher concentration than any other component of the acicular oxide. A leadframe package includes the leadframe, a semiconductor chip mounted on the leadframe, and a resin that covers the semiconductor chip and at least a part of the leadframe.

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Patent Owner(s)

Patent OwnerAddress
MITSUI HIGH-TEC INCKITAKYUSHU-SHI FUKUOKA 806-8588

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furuno, Ryota Kitakyushu, JP 6 9
Kubo, Kimihiko Kitakyushu, JP 6 9

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