Die stacked image sensors and related methods
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United States of America Patent
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Jul 27, 2021
Grant Date -
Jul 11, 2019
app pub date -
Mar 15, 2019
filing date -
Jun 2, 2015
priority date (Note) -
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Abstract
Implementations of image sensors may include: a first die including a plurality of detectors adapted to convert photons to electrons; a second die including a plurality of transistors, passive electrical components, or both transistors and passive electrical components; a third die including analog circuitry, logic circuitry, or analog and logic circuitry. The first die may be hybrid bonded to the second die, and the second die may be fusion bonded to the third die. The plurality of transistors, passive electrical components, or transistors and passive electrical components of the second die may be adapted to enable operation of the plurality of detectors of the first die. The analog circuitry, logic circuitry, and analog circuitry and logical circuitry may be adapted to perform signal routing.
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