Apparatus for burning in electronic components
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United States of America Patent
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Jul 20, 2021
Grant Date -
N/A
app pub date -
Jun 27, 2019
filing date -
Jun 29, 2018
priority date (Note) -
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Abstract
An apparatus for burning in electronic components, which includes a plurality of assemblies placed in a holder, each assembly comprising a printed circuit board on which are placed sockets intended to receive electronic components and a burn-in driver. The holder is at room temperature, and each assembly comprises a single chamber that is regulated to a temperature T°>80° C., in which chamber at least four sockets are placed. The printed circuit board forming one wall of the chamber, the burn-in driver is soldered directly to the printed circuit board on the side exterior to the chamber, with a single burn-in driver per chamber, and the assembly furthermore comprises means for dissipating only the thermal energy of operation of the burn-in driver.
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