Chemical mechanical planarization for tungsten-containing substrates

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United States of America Patent

PATENT NO 11066575
SERIAL NO

16560713

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Abstract

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Chemical mechanical polishing (CMP) compositions, systems and methods of using the compositions for polishing tungsten or tungsten-containing substrates. The compositions comprise nano-sized abrasive; metal compound coated organic polymer particles as solid state catalyst; oxidizer; tungsten corrosion inhibitor; and a water based liquid carrier.

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Patent Owner(s)

Patent OwnerAddress
VERSUM MATERIALS US LLC8555 SOUTH RIVER PARKWAY TEMPE AS 85284-3112

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Schlueter, James Allen Phoenix, US 21 108
Schwartz, Jo-Ann T Kennett Square, US 10 341
Shi, Xiaobo Chandler, US 87 369
Zhou, Hongjun Chandler, US 102 128

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