Semiconductor device and fingerprint identification device
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United States of America Patent
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Jun 29, 2021
Grant Date -
Oct 3, 2019
app pub date -
Sep 20, 2018
filing date -
Mar 28, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming a semiconductor device is provided. The method includes providing a substrate, placing a first stencil having a first openwork pattern on the substrate, applying a first material onto the substrate through the first stencil, and removing the first stencil from the substrate. The first material includes a transparent material. The method also includes placing a second stencil having a second openwork pattern on the substrate, applying a second material onto the substrate through the second stencil, and removing the second stencil from the substrate. The second material includes a light-shielding material, and the second openwork pattern is different from the first openwork pattern.
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