Resin plating method
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United States of America Patent
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Jun 29, 2021
Grant Date -
Jun 8, 2017
app pub date -
Apr 24, 2015
filing date -
Jul 10, 2014
priority date (Note) -
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Abstract
The present invention provides a resin plating method using an etching bath containing manganese as an active ingredient, the method being capable of maintaining stable etching performance even during continuous use. The resin plating method includes: an etching step, which uses a resin material-containing article as an object to be treated and etches the article using an acidic etching bath containing manganese; a catalyst application step, which uses palladium as a catalyst metal; and an electroless plating step; and the method further includes a step of maintaining the palladium concentration in the acidic etching bath at 100 mg/L or less.
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