Silicone-free thermal gel

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United States of America Patent

PATENT NO 11041103
APP PUB NO 20190078007A1
SERIAL NO

16105456

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Abstract

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The present disclosure provides a silicone free gel that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes a polyether polyol, a cross-linker, a coupling agent, an antioxidant, a catalyst, and at least one thermally conductive filler.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INTERNATIONAL INC855 SOUTH MINT STREET CHARLOTTE NC 28202

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Duan, Huifeng Shanghai, CN 8 65
Kang, Haigang Shanghai, CN 7 67
Liu, Ya Qun Shanghai, CN 24 179
Pan, Rongwei Shanghai, CN 6 10
Zhang, Liqiang Shanghai, CN 37 176
Zhang, Qi Shanghai, CN 768 6016

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