Chip bonding device and bonding method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11037900
APP PUB NO 20190164930A1
SERIAL NO

16312834

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Abstract

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A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

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Patent Owner(s)

Patent OwnerAddress
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD201203 NO 1525 EAST CHEUNG ROAD SHANGHAI PUDONG NEW AREA SHANGHAI CITY SHANGHAI CITY 201203

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Feibiao Shanghai, CN 13 17
Guo, Song Shanghai, CN 63 155
Sun, Jianqi Shanghai, CN 9 8
Wang, Tianming Shanghai, CN 28 68
Xia, Hai Shanghai, CN 12 29
Zhu, Yuebin Shanghai, CN 7 12

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