Printed circuit board and electronic device having the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11032901
APP PUB NO 20200163203A1
SERIAL NO

16662163

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Importance

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Abstract

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Provided is a printed circuit board including: a first flexible insulating layer; a first rigid insulating layer stacked on a first portion of the first flexible insulating layer; and an electronic element embedded in the first flexible insulating layer in stacked formation with the rigid insulating layer.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDMAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU SUWON-SI GYEONGGI-DO 16674

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Jung-Hwan Suwon-si, KR 57 1714

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