Method and apparatus of constructing secure infra-structure for using embedded universal integrated circuit card

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United States of America Patent

PATENT NO 11025611
APP PUB NO 20190098000A1
SERIAL NO

16198182

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Abstract

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A method of a responding entity for creating a secure link with a requesting entity in an embedded universal integrated circuit card (eUICC) environment is provided. The method includes: receiving, from the requesting entity, a secure link creation message including signature information of the requesting entity; verifying the signature information of the requesting entity by using trust information of the requesting entity, the trust information of the requesting entity being generated by a certificate authority (CA) and transferred to the responding entity; generating a shared key used for communication between the responding entity and the requesting entity; and creating the secure link with the requesting entity by using the shared key.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTDSUWON-CITY KYUNGKI-DO 441-373

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Joo Young Seoul, KR 321 2614
Kim, Kwan Lae Seoul, KR 21 435
Lee, Jin Hyoung Seoul, KR 54 719
Park, Chul Hyun Seoul, KR 31 455

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