Semiconductor packages having photon integrated circuit (PIC) chips
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United States of America Patent
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Jun 1, 2021
Grant Date -
Apr 30, 2020
app pub date -
Oct 26, 2018
filing date -
Oct 26, 2018
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Abstract
Memory devices having optical I/O interfaces are described herein. In one embodiment, a memory device includes a plurality of memories coupled to a substrate, each memory including one or more photon integrated (PIC) chips for converting electrical signals to/from optical signals. The memory device can further include a plurality of optical fibers, wherein individual ones of the memories are optically coupled to at least one of the optical fibers. The memories can receive/transmit the optical signals over the optical fibers and can be electrically coupled to a power supply/ground via the substrate.
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