Determining a thickness of a region of wall- or plate-like structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 1, 2021
Grant Date -
Jun 4, 2020
app pub date -
Aug 1, 2017
filing date -
Aug 11, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of determining a thickness of a region of wall- or plate-like structure which is thinner than a thickness of a surrounding region of the structure due to a cavity in the structure is disclosed. The method comprises comparing a measured time-frequency dispersion map for at least one dispersive guided wave obtained by measuring the structure using guided waves with a reference time-frequency dispersion map obtained by modelling the structure, determining a cut-off frequency, fc, at which the measured time-frequency dispersion map and the reference time-frequency dispersion map differ and calculating the thickness of the thinner region in dependence upon the cut-off frequency.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully