Adhesive film, preparation method of semiconductor device, and semiconductor device

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United States of America Patent

PATENT NO 11021634
APP PUB NO 20180265758A1
SERIAL NO

15571210

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Abstract

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The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDYOUNGDUNGPO-GU SEOUL 150-721

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hee Jung Daejeon, KR 45 451
Kim, Jung Hak Daejeon, KR 63 278
Kim, Se Ra Daejeon, KR 39 212
Kim, Young Kook Daejeon, KR 41 152
Lee, Kwang Joo Daejeon, KR 52 74
Nam, Seung Hee Daejeon, KR 72 530

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