Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 11018105
SERIAL NO

16601837

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Abstract

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A semiconductor device includes a semiconductor chip, a bump contract, and encapsulating layer, an insulating layer, and a connection terminal.

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Patent Owner(s)

Patent OwnerAddress
CYPRESS SEMICONDUCTOR CORPORATION198 CHAMPION COURT SAN JOSE CA 95134

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kasai, Junichi Kanagawa, JP 110 3494
Onodera, Masanori Tokyo, JP 73 1778

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