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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
FUJIMI INCORPORATED	NISHIKASUGAI-GUN AICHI 452-8502

International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
• G09G:ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING....
• G01G:WEIGHING

• 2018 Application Filing Year
• C09K Class
• 2902 Applications Filed
• 1876 Patents Issued To-Date
• 64.65 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Tseng, Tzu-Chun	Tongluo Township, TW	6	49
# of filed Patents : 6 Total Citations : 49

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Patent Citation Ranking

• 0 Citation Count
• C09K Class

• 0 % this patent is cited more than
• 4 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Nov 25, 2024
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 25, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 25, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 25, 2021	US,11015087,B2   US11015087B2	GRANTED PATENT AS SECOND PUBLICATION
March 28, 2019	US,20190092974,A1   US20190092974A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 11015087

Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate

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Abstract

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A polishing composition according to the present invention includes: silica; an anionic water-soluble polymer; at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound; and a dispersing medium.

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Description

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Claims

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Aug 30, 2018	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TSENG, TZU-CHUN;REEL/FRAME:046893/0674 Owner name: FUJIMI INCORPORATED, JAPAN Effective Date: Aug 30, 2018
Sep 26, 2017	PD	Priority Date