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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NIPPON PILLAR PACKING CO LTD	JAPAN'S OSAKA OSAKA YODO AREA WILD SOUTH 2 CHOME 11 NO 48 OSAKA-SHI OSAKA

International Classification(s)

• B23B:TURNING; BORING
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hayashi, Tomoki	Osaka, JP	26	73
Kobayashi, Miyuki	Osaka, JP	5	61
Okunaga, Takeshi	Osaka, JP	9	54
Tamaki, Tatsuya	Osaka, JP	7	23
Yamasaki, Kenpei	Osaka, JP	1	0

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Nov 25, 2024
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 25, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 25, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 25, 2021	US,11014336,B2   US11014336B2	GRANTED PATENT AS SECOND PUBLICATION
March 04, 2021	US,20210060902,A1   US20210060902A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 11014336

Circuit board and method for manufacturing the same

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