Semiconductor device and method of making a semiconductor device
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United States of America Patent
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May 18, 2021
Grant Date -
May 25, 2017
app pub date -
Nov 3, 2016
filing date -
Nov 20, 2015
priority date (Note) -
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Abstract
A semiconductor device and a method of making the same. The device includes a semiconductor substrate having a major surface, a backside and side surfaces extending between the major surface and the backside. The semiconductor device also includes at least one metal layer extending across the backside of the substrate. A peripheral part of the at least one metal layer located at the edge of the substrate between the backside and at least one of the side surfaces extends towards a plane containing the major surface. This can prevent burrs located at the peripheral part of the at least one metal layer interfering with the mounting of the backside of the substrate on the surface of a carrier.
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