Method and apparatus for transfer of two-dimensional materials
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United States of America Patent
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May 4, 2021
Grant Date -
Feb 18, 2021
app pub date -
May 21, 2019
filing date -
May 22, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
Aspects of the disclosure include systems and methods for removing a sample from a carrier material and depositing the sample onto a substrate. The sample can be placed in an aperture of a substrate guide on a stage within a cavity. Etching fluid can be introduced into the cavity to etch the carrier material from the sample and then drained. A rinsing material can be introduced into the cavity to rinse the etching fluid and then drained. A sample deposition process can be performed wherein rinsing fluid is introduced into the cavity to raise the sample guide and sample above the level of a substrate on a substrate holder. The substrate holder can be positioned relative to the sample guide so that the sample within the aperture aligns with the substrate on the substrate holder. The rinsing fluid is drained so that the sample is lowered onto the substrate.
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