Semiconductor device and method for manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10991678
APP PUB NO 20200294972A1
SERIAL NO

16884559

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Abstract

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The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDYOUNGDUNGPO-GU SEOUL 150-721

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jo, Jung Ho Daejeon, KR 54 137
Kim, Hee Jung Daejeon, KR 45 451
Kim, Jung Hak Daejeon, KR 63 278
Kim, Se Ra Daejeon, KR 39 212
Kim, Young Kook Daejeon, KR 41 152
Lee, Kwang Joo Daejeon, KR 52 74
Nam, Seung Hee Daejeon, KR 72 530

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