Integrated circuit, and motor device including the same
Number of patents in Portfolio can not be more than 2000
United States of America
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Apr 27, 2021
Grant Date -
Aug 8, 2019
app pub date -
Feb 4, 2019
filing date -
Feb 4, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.
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