Method of forming a package
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United States of America
Stats
-
Apr 20, 2021
Grant Date -
Sep 10, 2020
app pub date -
May 26, 2020
filing date -
May 26, 2020
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a package is provided and includes providing two laminate edge portions of the package, each of which includes a foil layer between first and second resin layers; and welding together the respective first resin layers at a first position spaced apart from the edges while not welding the respective first resin layers at the edges, wherein the edge portions include edges from which electrode terminals extend such that portions of the electrode terminals are exposed beyond the edges, and wherein the edge portions are between a sealing portion and exposed portions of positive and negative electrode terminals.
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- B29C Class
- 0 % this patent is cited more than
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