Glass-free dielectric layers for printed circuit boards
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United States of America
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Apr 20, 2021
Grant Date -
Aug 15, 2019
app pub date -
Feb 13, 2018
filing date -
Feb 13, 2018
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Abstract
According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.
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