MEMS devices and methods of forming the same
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United States of America
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Apr 20, 2021
Grant Date -
Jul 12, 2018
app pub date -
Mar 2, 2018
filing date -
Mar 2, 2018
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.
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