Semiconductor package including EMI shielding structure and method for forming the same
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United States of America
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Apr 13, 2021
Grant Date -
Jan 17, 2019
app pub date -
Jun 13, 2018
filing date -
Jun 13, 2018
priority date (Note) -
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Abstract
A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.
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