Method and device for bonding substrates

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United States of America

PATENT NO 10971365
SERIAL NO

16481994

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Abstract

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A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBHDI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hesser, Gunther Linz, AT 2 0
Hingerl, Kurt Wolfern, AT 12 48
Oberhumer, Peter Nikolaus Gaspoltshofen, AT 2 0

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