Non-contact measurement of a stress in a film on a substrate
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United States of America Patent
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Mar 30, 2021
Grant Date -
May 14, 2020
app pub date -
Jan 13, 2020
filing date -
Apr 20, 2017
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Abstract
A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.
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