Device and method for pressure-molding anti-overheating CSP fluorescent membrane

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United States of America Patent

PATENT NO 10962178
APP PUB NO 20190277457A1
SERIAL NO

16349589

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Abstract

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Disclosed are a device and a method for pressure-molding an anti-overheating CSP fluorescent membrane. The device comprises a frame, a mould pressing device, a force measuring device, a control device and a feeding device; and the mould pressing device comprises an upper pressing mould, an upper clamp, a lower pressing mould, a guide post, an elastic supporting structure, and a lower clamp. As the stage of pressing the elastic supporting structure is added to the course of pressure molding, a mould clamping force of the pressure molding increases in a relatively steady way, and a force impact of a mould clamping device is reduced, thereby easily determining an initial point for maintain temperature of the pressure molding. The present invention effectively prevents overheating caused by long-term and large-area contact between the lower clamp and the heating lower pressing mould, and avoids the process defect of premature melting of the fluorescent membrane due to overheating, thereby greatly improving the product consistency and yield rate of the CSP-package fluorescent membrane in the pressure molding process.

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Patent Owner(s)

Patent OwnerAddress
SOUTH CHINA UNIVERSITY OF TECHNOLOGY510640 NO FIVE 381 MOUNTAIN ROAD GUANGZHOU GUANGDONG TIANHE DISTRICT GUANGZHOU CITY GUANGDONG PROVINCE 510640

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Zongtao Guangdong, CN 10 9
Liang, Guanwei Guangdong, CN 2 0
Lin, Qinghong Guangdong, CN 3 26
Lu, Longsheng Guangdong, CN 4 2
Tang, Yong Guangdong, CN 87 515
Wang, Huiyu Guangdong, CN 7 27
Yu, Shudong Guangdong, CN 2 0

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