Method for frequency trimming a microelectromechanical resonator
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United States of America Patent
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Mar 16, 2021
Grant Date -
Aug 9, 2018
app pub date -
Jan 19, 2018
filing date -
Jan 19, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B81C:PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE M....
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- H04R:LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR ....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- H03H:IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONA....
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