Mold clamping device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10940615
APP PUB NO 20190016018A1
SERIAL NO

16068687

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Importance

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Abstract

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Provided is a mold clamping device that can simplify the component count or structure by including a mold thickness adjustment mechanism that reduces the load on a power source, is easily maintained, and has high design flexibility. Also provided is a mold clamping device that can set a long distance (daylight) between molds without having to upsize the entire mold clamping device and can simplify the component count or structure.

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Patent Owner(s)

Patent OwnerAddress
KYORAKU CO LTDKYOTO JAPAN KYOTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Shuji Kanagawa, JP 102 1168
Muroya, Yosuke Kanagawa, JP 8 5
Ono, Yoshinori Kanagawa, JP 30 193
Shimada, Kengo Kanagawa, JP 4 11

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