Methods of forming microelectronic devices including dummy dice
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United States of America Patent
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Mar 2, 2021
Grant Date -
N/A
app pub date -
Aug 14, 2019
filing date -
Jun 3, 2015
priority date (Note) -
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Abstract
A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side.
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