Slip-plane MEMS probe for high-density and fine pitch interconnects
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United States of America Patent
Stats
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Mar 2, 2021
Grant Date -
Apr 2, 2020
app pub date -
Sep 28, 2018
filing date -
Sep 28, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Calculated Rating
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US Family Size
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Non-US Coverage
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Abstract
A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.
First Claim
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International Classification(s)
- 2018 Application Filing Year
- H01L Class
- 30734 Applications Filed
- 24554 Patents Issued To-Date
- 79.90 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 52.76 % this patent is cited more than
- 4 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Sep 2, 2028 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Sep 2, 2032 |
