Assembly and process for heat transfer with three surfaces
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United States of America Patent
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Feb 23, 2021
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N/A
app pub date -
Jun 13, 2014
filing date -
Aug 16, 2013
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Abstract
A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.
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