Semiconductor device

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United States of America Patent

PATENT NO 10920109
APP PUB NO 20180237663A1
SERIAL NO

15752151

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Abstract

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The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

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Patent Owner(s)

Patent OwnerAddress
LG CHEM LTDYOUNGDUNGPO-GU SEOUL 150-721

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hee Jung Daejeon, KR 45 451
Kim, Jung Hak Daejeon, KR 63 278
Kim, Se Ra Daejeon, KR 39 212
Kim, Young Kook Daejeon, KR 41 152
Lee, Kwang Joo Daejeon, KR 52 74
Nam, Seung Hee Daejeon, KR 72 530

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