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Country	kind	publication No.	Filing Date	Type	Sub-Type
KR	B1	KR102671467	Sep 28, 2016	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT SPECIFICATION		반도체 패키지를 포함하는 반도체 모듈 및 반도체 패키지		Jun 03, 2024
TW	B	TWI749069	Sep 28, 2017	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT OR PATENT OF ADDITION		SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE		Dec 11, 2021
CN	B	CN107871720	Sep 28, 2017	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT FOR INVENTION		Semiconductor module including semiconductor package and semiconductor package		Dec 20, 2022
US	B2	US12025656	Nov 30, 2020	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT AS SECOND PUBLICATION		Semiconductor module including semiconductor package and semiconductor package		Jul 02, 2024

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SAMSUNG ELECTRONICS CO LTD	SUWON-SI GYEONGGI-DO 16677

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• G01K:MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT;....
• G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
• G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
• G01T:MEASUREMENT OF NUCLEAR OR X-RADIATION

• 2017 Application Filing Year
• H01L Class
• 30754 Applications Filed
• 25260 Patents Issued To-Date
• 82.14 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kang, Dan-Kyu	Anyang-si, KR	5	6
# of filed Patents : 5 Total Citations : 6
Lee, Sang-Yeol	Suwon-si, KR	10	29
# of filed Patents : 10 Total Citations : 29
Won, Seyoung	Seoul, KR	2	1
# of filed Patents : 2 Total Citations : 1

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Patent Citation Ranking

• 0 Citation Count
• H01L Class

• 0 % this patent is cited more than
• 4 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Aug 2, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 2, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 02, 2021	US,10908209,B2   US10908209B2	GRANTED PATENT AS SECOND PUBLICATION
March 29, 2018	US,20180088173,A1   US20180088173A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 10908209

Semiconductor module including semiconductor package and semiconductor package

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Abstract

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A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

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Description

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Claims

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Claims data not available

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Legal Events

 

• MAFP2024
• P2021
• STCF2021
• STPP2020
• STPP2020
• STPP2020
• STPP2020
• STPP2020
• P2018
• STPP2018
• F2017
• AS2017
• FEPP2017
• PD2016

Date	Code	Event	Description
Jul 17, 2024	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Feb 02, 2021	P	Publication
Jan 13, 2021	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Dec 23, 2020	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: PUBLICATIONS -- ISSUE FEE PAYMENT VERIFIED
Oct 09, 2020	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS
Sep 10, 2020	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER
Jun 24, 2020	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: NON FINAL ACTION MAILED
Apr 01, 2020	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER
Mar 29, 2018	P	Published
Mar 21, 2018	STPP	INFORMATION ON STATUS: PATENT APPLICATION AND GRANTING PROCEDURE IN GENERAL	free format text: DOCKETED NEW CASE - READY FOR EXAMINATION
Sep 26, 2017	F	Filing
Sep 26, 2017	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WON, SEYOUNG;KANG, DAN-KYU;LEE, SANG-YEOL;SIGNING DATES FROM 20170309 TO 20170319;REEL/FRAME:043703/0773 Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF
Sep 26, 2017	FEPP	FEE PAYMENT PROCEDURE	free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Sep 28, 2016	PD	Priority Date