Package structure having a plurality of insulating layers

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United States of America Patent

PATENT NO 10903136
APP PUB NO 20190139860A1
SERIAL NO

16183128

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Abstract

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A package structure is provided, including a first insulating layer, a second insulating layer, a third insulating layer, and a chip. The second insulating layer is disposed on the first insulating layer, the chip is disposed in the second insulating layer, and the third insulating layer is disposed on the second insulating layer. The heat conductivity of the second insulating layer is lower than the heat conductivity of the first insulating layer, and the hardness of the second insulating layer is lower than the hardness of the first insulating layer.

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Patent Owner(s)

Patent OwnerAddress
TDK TAIWAN CORPTAOYUAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tseng, An-Ping Taoyuan, TW 7 30
Wu, Chi-Fu Taoyuan, TW 9 182
Wu, Hao-Yu Taoyuan, TW 21 384
Wu, Ming-Hung Taoyuan, TW 21 77

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