Developing method, developing apparatus, and computer-readable recording medium
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United States of America Patent
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Jan 26, 2021
Grant Date -
Feb 21, 2019
app pub date -
Sep 7, 2018
filing date -
Jul 25, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
There is provided a method of developing an exposed resist film formed on a surface of a substrate to form a resist pattern, which includes: rotating the substrate about a rotation axis that extends in a direction perpendicular to the surface of the substrate that is horizontally supported; supplying a developing solution through a discharge hole positioned above the substrate onto the resist film such that the developing solution is widely spread on a surface of the resist film; and positioning a wetted part having a surface that faces the surface of the substrate, above a preceding region in the surface of the substrate, the preceding region being a region to which the developing solution is preferentially supplied through the discharge hole.
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